Sony have recently exhibited a new prototype cooling sheet, made of silicon and packed with carbon fibre it has been designed to take the place of thermal grease in conducting heat away from the computers processor towards a heatsink. The company claims the life of the new sheet is longer than current thermal grease solutions which degrade a lot quicker.
The sheet named the EX20000C was shown off by Sony at a recent Tokoyo exhibition, on the show floor the company demonstrated that a CPU using the new thermal sheet was cooler by three degrees celsius compared to its greasy counterpart. It’s worth noting however that Sony didn’t specify the specs of the computer or the thermal paste used in the demonstration.
via: Tech On